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Ultra Fast CoPack IGBT
Generation 4 IGBT design provides tighter parameter distribution and higher efficiency (minimun switching and conduction losses) than pior generations
IGBT co-package with HEXFRED ultrafast, ultrasoft recovery anti-parallel diodes for use in brigge configurations
Industry-benchmark Super-247 package with hogher power handling capability comparared to same footprint TO-247
Creepage distance increased to 5.35 mm
Lead-Free
Semiconductors High Power Equipment Repair