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LDIP-IPM
High latch-up immunity
Low switching loss and higher short-circuit withstanding capability
Low temperature coefficient effect both for driver and IGBT
Integrated driver IC to reduce the PCB size and layout effort
High noise rejection capability
Under-voltage lockout protection both for high and low side IGBT
High VCC and input signal port voltage rating
Good thermal performance
Matched propagation delay for three arms
Automatic shut-off the high and low side IGBT to avoid shoot-through conduction in case the driving signal is abnormal
Provided a fault signal (FO pin) and shut-off internal IGBT, when OC/SC and under-voltage situation are occurred
Semiconductors High Power Equipment Repair