Features
- Ultra Fast CoPack IGBT
- Generation 4 IGBT design provides tighter parameter distribution and higher efficiency (minimun switching and conduction losses) than pior generations
- IGBT co-package with HEXFRED ultrafast, ultrasoft recovery anti-parallel diodes for use in brigge configurations
- Industry-benchmark Super-247 package with hogher power handling capability comparared to same footprint TO-247
- Creepage distance increased to 5.35 mm
- Lead-Free
Aplications
- Semiconductors High Power Equipment Repair
IRG4PSC71UDPBF
Referencias Específicas
- Nº Pieza fabricante (NPM)
- IRG4PSC71UDPBF