- On request
MODULOS IGBT
Última actualización
260A/1200V/6U
No Identificado
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IGBT MODULE
Homogeneous SI
SPT = Soft Punch Through Technology
VCESAT with positive temperature coefficient
High Short circuit capability, self limiting to 6 x IC
Isolated by AI2O3 DCB (Direct Copper Bonded) ceramic plate
Pressure contact technology for thermal contacts
Spring contact system to attach driver PCB to the control terminals
Integrated temperature sensore
Applications
AC inverter drives
Uninterruptible Power
supplies